What’s New at AEIM

​​AEIM Achieves First Milestone in Wafer Processing: Successful Cutting of Sapphire Ingot into C-Plane (0001) Wafers

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AEIM proudly announces a landmark achievement in its journey to becoming a world-class semiconductor materials supplier — the successful cutting of its first sapphire ingot into C-plane (0001) wafers at its advanced AEIM manufacturing facility. This milestone marks not only the initiation of wafer processing operations but also demonstrates AEIM’s growing technical capabilities in crystal science, precision engineering, and substrate preparation for compound semiconductor technologies.

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The C-plane orientation (0001) of sapphire is the most widely adopted substrate for Gallium Nitride (GaN) epitaxy, due to its favorable hexagonal crystal symmetry and close lattice compatibility with GaN. This unique alignment minimizes strain during epitaxial film deposition, helping reduce threading dislocations and structural defects. As a result, devices fabricated on C-plane sapphire wafers achieve higher reliability, better performance, and longer operational lifetimes. For decades, this orientation has powered innovations in LED lighting, RF filters, laser diodes, photonics, and next-generation power electronics, and AEIM’s entry into this space reflects its ambition to be at the forefront of the global semiconductor ecosystem.

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The ingot slicing process was executed using state-of-the-art diamond wire saws, specifically optimized for sapphire’s extreme hardness and brittleness. AEIM engineers fine-tuned parameters such as wire speed, wire tension, and abrasive slurry feed to ensure minimal kerf loss, thereby maximizing wafer yield per ingot. The slicing process achieved surface roughness (Ra) within sub-micron levels, wafer flatness with tight bow and warp control, and excellent edge stability — all critical for downstream epitaxial growth. Immediately after slicing, wafers are subjected to a multi-step finishing process including lapping, precision grinding, and chemical-mechanical polishing (CMP). These processes progressively refine wafer surfaces to achieve atomically smooth topographies, removing microcracks, scratches, and subsurface damage. CMP in particular allows AEIM to reach surface roughness levels on the order of angstroms, ensuring that wafers are epitaxy-ready for MOCVD deposition systems used by device manufacturers.

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From a materials science perspective, the wafers exhibit orientation accuracy within ±0.1°, which is critical for aligning GaN epitaxial layers during deposition. Furthermore, defect density and micropipe occurrence were carefully monitored and reduced, allowing AEIM to deliver wafers with superior crystal integrity. The thermal and optical properties of sapphire add to their appeal: with a wide bandgap (~9 eV), excellent dielectric strength, and high thermal conductivity, sapphire substrates can withstand extreme operating conditions while effectively managing heat dissipation in high-power devices.

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AEIM’s wafering achievement is not an isolated step, but rather a strategic part of its vertically integrated roadmap. Beginning with sapphire crystal growth through advanced techniques, moving to ingot processing, wafer slicing, and surface finishing, and extending ultimately into epitaxy and device-level manufacturing, AEIM is building a complete value chain within India. This integration reduces dependence on external suppliers and creates a resilient supply chain for critical semiconductor components. It also positions AEIM as one of the few companies globally with the capability to provide end-to-end substrate solutions.

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Looking ahead, AEIM plans to scale wafer production capacity while expanding into larger diameter wafers (up to 6-inch and beyond), enabling higher throughput for device manufacturers. The company is also investing in advanced surface treatment technologies, including plasma cleaning and atomic-layer polishing, to further reduce defectivity and prepare substrates for the most demanding epitaxial applications. In parallel, research and development efforts are underway to explore alternative orientations (A-plane, R-plane, and M-plane) to serve specialized device applications in photonics, sensors, and UV optoelectronics.

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This milestone underscores AEIM’s commitment to material innovation, precision manufacturing, and technological independence. By mastering the art and science of sapphire wafering, AEIM is enabling the foundation upon which next-generation electronics will be built — from energy-efficient lighting to 5G communications, high-frequency RF modules, and advanced power switching devices. More than just a production achievement, the first cut wafer symbolizes AEIM’s entry into the global semiconductor supply chain and its determination to contribute meaningfully to both domestic and international markets.

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AEIM’s first sapphire ingot slicing is more than a technological milestone — it represents the start of a journey toward becoming a trusted, high-performance substrate partner for innovators worldwide.