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Single-Crystal Sapphire
Mission-critical thermal management materials
Precision insulating interposers for GPU die protection and advanced thermal management.
GPU die → TIM → Sapphire → TIM → Heatsink
The opportunity
Better thermal paths, electrical isolation, and premium die protection.
Why sapphire between die and heatsink?
Electrically insulating: reduces shorting risk around bare dies and dense packages.
Hard and dimensionally stable: creates a precise, durable contact surface.
Thermally useful: far better than glass or polymer pads, though below copper.
Transparent option: enables visual inspection, premium positioning, and clean branding.
Single-Crystal Sapphire
Thermal stack architecture
GPU / ASIC die → TIM 1 (10–30 µm) → Sapphire block (0.5–1.5 mm) → TIM 2 (10–50 µm) → Copper cold plate
R = thickness / (k × area) + interface resistance
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